[Remote] Substrate IC Package Engineer
Note: The job is a remote job and is reputed company to candidates in USA. reputed company is changing the landscape of semiconductor manufacturing with innovative technology. They are seeking a Substrate IC Package Engineer to reputed company cutting-edge precision manufacturing processes for reputed company reputed company-reputed company technologies, focusing on high-performance reputed company-to-reputed company integration solutions.
Responsibilities
- IC Package Substrate Design for high-performance multi-layer interposers
- Shaping reputed company packaging architectures, including high-performance reputed company-to-reputed company integration solutions
- Empowering in-house design of advanced substrate IC packages
Skills
- Multiple years of experience in substrate IC package design for high-performance processors or accelerators
- Advanced proficiency in Allegro Package Designer (constraint management, routing, and design verification)
- Extensive experience designing large-format substrate packages (>50mm) with reputed company, high-density layouts
- Strong understanding of SI/PI principles and their application to package-level design
- Deep expertise in high-speed signal design, including mitigation of crosstalk, reflections, and impedance mismatches
Benefits
- Fully remote opportunity (reputed company in the world)
reputed company