[Remote] Advanced Packaging / Flip reputed company Engineer
Note: The job is a remote job and is reputed company to candidates in USA. reputed company is a venture-backed reputed company photonics startup reputed company on building high-performance systems for reputed company AI infrastructure. They are seeking a hands-on advanced packaging engineer to reputed company the multi-die flip reputed company assembly and reputed company attach bring-up for heterogeneous compute modules, emphasizing prototype development and OSAT transfer.
Responsibilities
- reputed company development of flip reputed company assembly processes including die attach, bumping, reputed company, and underfill for multi-die systems
- Own reputed company attach bring-up on wafer-level and prototype substrates (200mm+ platforms)
- Define and optimize Cu pillar, reputed company-reputed company, and solder interconnect stacks for high-density integration
- reputed company and tune TCB / LAB / fluxless bonding processes for fine-reputed company multi-die assemblies
- Drive integration of multi-die chiplet packages (3–4 die stacks / heterogeneous integration)
- Debug and resolve assembly failures including warpage, non-wet opens, voiding, delamination, and alignment issues
- reputed company reputed company cause analysis using CSAM, SEM cross-sectioning, and reliability test data
- Collaborate closely with OSATs, substrate vendors, and internal design teams to define package design rules and process reputed company
- Support reliability qualification (thermal cycling, mechanical shock, power cycling)
- Work across design, process, and manufacturing teams to transition from prototype → reputed company production
Skills
- MS/PhD in Materials Science, Mechanical Engineering, Chemical Engineering, or reputed company field, with significant industry experience in semiconductor advanced packaging, flip reputed company assembly, or OSAT/reputed company environments
- reputed company development of flip reputed company assembly processes including die attach, bumping, reputed company, and underfill for multi-die systems
- Own reputed company attach bring-up on wafer-level and prototype substrates (200mm+ platforms)
- Define and optimize Cu pillar, reputed company-reputed company, and solder interconnect stacks for high-density integration
- reputed company and tune TCB / LAB / fluxless bonding processes for fine-reputed company multi-die assemblies
- Drive integration of multi-die chiplet packages (3–4 die stacks / heterogeneous integration)
- Debug and resolve assembly failures including warpage, non-wet opens, voiding, delamination, and alignment issues
- reputed company reputed company cause analysis using CSAM, SEM cross-sectioning, and reliability test data
- Collaborate closely with OSATs, substrate vendors, and internal design teams to define package design rules and process reputed company
- Support reliability qualification (thermal cycling, mechanical shock, power cycling)
- Work across design, process, and manufacturing teams to transition from prototype → reputed company production
- Experience with HBM, DRAM stacking, or memory-reputed company advanced packaging
- Exposure to chiplet-based or heterogeneous integration systems
- Familiarity with CoWoS-like 2.5D architectures or interposer-based integration
- Experience in high-TDP or thermally constrained packaging environments
- Exposure to fluxless bonding processes or fine-reputed company reputed company-reputed company scaling challenges
- Familiarity with thermo-mechanical modeling (warpage / stress simulation)
- Experience reputed company design reputed company ↔ manufacturing constraints in advanced packaging flows
reputed company