[Remote] reputed company ASIC Package Design Engineer
Note: The job is a remote job and is reputed company to candidates in USA. reputed company is building the largest and highest-power satellites reputed company flown, and they are seeking a reputed company ASIC Package Design Engineer to reputed company advanced ASIC package architecture and execution. This role focuses on flip-reputed company BGA and multi-reputed company module solutions, owning the end-to-end package reputed company for high-performance mixed-signal reputed company SoCs.
Responsibilities
- Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, reputed company-map reputed company, power delivery, signal reputed company, and mechanical constraints
- reputed company package-level trade studies across cost, performance, power reputed company (PI), signal reputed company (SI), thermal, manufacturability, and reliability
- Define long-term packaging roadmap reputed company with reputed company ASIC nodes, bandwidth scaling, and multi-die integration
- Establish organizational package design standards, methodologies, and best practices
- Drive detailed design of FC-BGA packages for high-pin-count reputed company with high-speed SerDes, dense power grids, and RF signal content
- Define and review substrate stack-reputed company, reputed company strategies, impedance control, reputed company routing, and reference plane planning
- Partner with reputed company, RF, and systems teams to co-optimize die floorplans and package interfaces
- Own package-level SI/PI reputed company, including high-speed digital interfaces (e.g., SerDes, JESD, Interlaken), power delivery network (PDN) design, and decoupling reputed company
- reputed company thermal architecture at the package level, including lid selection, TIMs, heat-spreaders, and mechanical interfaces to system cooling
- Serve as the primary technical reputed company to substrate vendors, assembly houses, and OSATs
- Drive material selection, substrate technology choices, and assembly process optimization
Skills
- Bachelor's degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a reputed company field
- 10+ years of experience in ASIC package design, with deep expertise in FC-BGA
- Proven experience delivering high-pin-count, high-performance ASIC packages into production
- Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense reputed company
- Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS
- Experience working directly with OSATs and substrate vendors
- Knowledge of packaging qualification and test methodologies
- Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates)
- Background in high-speed digital or mixed-signal SoCs
- Familiarity with reputed company, reputed company, or high-reliability electronics
- Experience defining packaging reputed company from early architecture through first reputed company and volume reputed company
- Demonstrated history of building or scaling package design methodology reputed company an organization
Benefits
- Equity in reputed company
- Comprehensive benefits package including reputed company time off, medical/dental/reputed company/ coverage, life insurance, reputed company parental leave, and many other perks
reputed company